[1]
Ruifeng
Li, Daoguo Yang*, Ping Zhang* , Fanfan Niu, Miao Cai and Guoqi Zhang, Effects
of High-Temperature Storage on the Glass
Transition Temperature of Epoxy
Molding Compound, Journal of Electronic Packaging, 2021, 143(1)). （SCI）
[2]
Zhixiang
Liu，Gongqin
Yan，Xinmei
Liu ,Yunqing Tang, Zhao Mo* ,Daoguo Yang*, Study on
photoelectric properties of Al-Eu codoped ZnO, Journal of Alloys and
Compounds,2021,882:1-5. (SCI收录) （中科院SCI分区2区）
[3]
Zhixiang
Liu, Weimin Guo, Xinmei Liu, Guanyu Wu, Yunqing Tang, Zhao Mo ,Daoguo Yang*,
Study on photoelectric properties of Fe-Co codoped g-C3N4 Chemical Physics
Letters，781
(2021) ：1-6.
(SCI收录)
（中科院SCI分区3区）
[4]
Shirui
Xue, Sicheng Cao, Zhaoling Huang, Daoguo Yang* and Guoqi Zhang,
Improving Gas-Sensing Performance Based on MOS Nanomaterials: A Review,
Materials, 2021, 14, 4263: 1-13. (SCI收录) （中科院SCI分区3区）
[5]
Daoguo
Yang, Daoshuang Geng*, Lixia Zheng, Miao Cai, Weidong Hao, Entropy-based
analysis and classification of acute tonic pain from microwave transcranial
signals obtained via the microwave-scattering approach， Biomedical
Signal Processing and Control，Volume 65, March 2021, 102391。
[6] Daoguo
Yang,
Daoshuang Geng*, Lixia Zheng, Miao Cai, Weidong Hao, Entropy-based analysis and
classification of acute tonic pain from microwave transcranial signals obtained
via the microwave-scattering approach, Biomedical Signal Processing and
Control, 2020, 64, 102391. (SCI&EI收录，IF: 3.173)
[7]
Daoshuang Geng, Daoguo Yang*, Miao Cai, Weidong Hao, Evaluation of
acute tonic cold pain frommicrowave transcranial transmission signalsusing
multi-entropy machine learning approach, IEEE Access,8 (2020): 2780-2791.
(SCI&EI收录，IF：3.745)
[8 Daoshuang Geng, Daoguo Yang*,
Miao Cai, Lixia Zheng, A novel microwave treatment for sleep disorders and
classification of sleep stages using multi-scale entropy, Entropy, 2020, 22(3),
347. (SCI收录，IF：2.496)
[9] Miao Cai, Peng Cui, Yikang Qin,
DaoshuangGeng, Qiqin Wei, Xiyou Wang, Daoguo Yang*, Guoqi Zhang.
Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical
Components—A Review[J]. Entropy, 2020, 22(2):254.(SCI收录，IF：2.496)
[10] Miao Cai*, Zhi Liang, Yikang Qin, Jiajie
Fan, Ding Ma, Daoguo Yang*, Guoqi Zhang. Effects of silicone lens
aging on degradation kinetics of light-emitting diode package in various
accelerated testing[J]. Optical Materials, 2020, (107): 110071.
[11] X. Li, M. Cai*, L. Wang, F.
Niu, D.G. Yang*, G.Q. Zhang, Evaluation survey of microbial
disinfection methods in UV-LED water treatment systems[J]. Science of the Total
Environment, 659 (2019), pp: 1415-1427. (SCI收录, IF: 4.610, JCR二区)
[12] Daoshuang Geng, Daoguo
Yang*（杨道国）, Miao Cai, Weidong Hao, Xiaoping
Li, Detection of acute tonic cold pain from microwave transcranial transmission
signals obtained via the microwave scattering approach, IEEE Access; 2019, Vol.
7, Pages: 142388-142405. (SCI收录）
[13] Wei, Q., Xiao, J., Chen, S., Wang, Q.,
Cai, M., Yang, D*（杨道国）., & Qin, H. (2019).
Asymmetric Long-Range Surface Plasmon Polariton Waveguides for Sensing
Applications. IEEE Photonics Journal, 11(6), 1-9.
(SCI收录）
[14] Niu Fanfan, Cai
Miao, Pang Jiu, Li Xiaoling, Zhang Guoqi, Yang Daoguo*（杨道国），A first-principles
study: Adsorption of small gas molecules on GeP3 monolayer，Surface Science，Surface Science 684
(2019) 37–43。(SCI收录）
[15] Fanfan Niu, Miao Cai, Jiu Pang,
Xiaoling Li, Daoguo Yang*（杨道国）, Guoqi Zhang，Gas molecular
adsorption effects on the electronic and optical properties of monolayer SnP3，Vacuum 168 (2019)
108823，pp：1-7。(SCI收录）
[16] Liu Tianhan, Qin Hongbo* ，Yang Daoguo, Zhang Guoqi.
First Principles Study of Gas Molecules Adsorption on Monolayered β-SnSe.
Coatings, 2019, 9(6), 390. (SCI)
[17] Feng Chuang, Qin Hongbo*, Yang
Daoguo, Zhang Guoqi. (2019). First-principles investigation of the
adsorption behaviors of CH2O on BN, AlN, GaN, InN, BP, and P
monolayers. 2019, Materials, 12(4), 676. (SCI)
[18] WeiQiqin, Xiao Jing, Chen Shirong, Wang
Quan, Sun Peng, Cai Miao, Yang Daoguo, Design and analysis of a
novel phase-shifted Bragg grating for Bloch surface waves, IEEE Photonics
Journal, 10(5), 2018/09 (SCI收录).
[19] Qin Hongbo, Feng Chuang, Luan
Xinghe, Yang Daoguo*. First-principles investigation of adsorption
behaviors of small molecules on penta-graphene. Nanoscale research letters,
2018, 13(1), 264. (SCI)
[20]
Feng Chuang, Qin Hongbo*, Luan, Xinghe, Kuang Tianfeng, Yang
Daoguo. Gas sensing properties of two-dimensional penta-BP5: A first-principle
study. 2018, Chemical Physics Letters, 706, 355-359. (SCI)
[21]
Qin Hongbo, Kuang Tianfeng, Luan Xinghe, Li Wangyun, Xiao Jing, Zhang
Ping, Yang Daoguo, Zhang Guoqi, Influence of pressure on
the mechanical and electronic properties of wurtzite and zinc-blende GaN
crystals. 2018, Crystals, 8(11): 428. (SCI)
[22] Yang, Ning; Yang,
Daoguo; Chen, Liangbiao; et al., Design and adjustment of the graphene
work function via size, modification, defects, and doping: a first-principle
theory study, NANOSCALE RESEARCH LETTERS Volume:
12 Article Number: 642 Published: DEC 29
2017.
[23] Li, Zhe; Yang, Daoguo; Hao,
Weidong; et al. Ultrasonic vibration-assisted micro-hole forming on skull
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF
ENGINEERING MANUFACTURE Volume: 231 Issue: 14
Special Issue: SI Pages: 2447-2457 Published: DEC 2017。
[24] Ning Yang, Daoguo Yang, Liangbiao
Chen，
et al. A First-Principle Theoretical Study of Mechanical and Electronic
Properties in Graphene Single-Walled Carbon Nanotube Junctions，MATERIALS， NOV 2017，Volume: 10
Issue: 11。
[25] Hongbo Qin, Xinghe Luan, Chuang
Feng, Daoguo Yang and Guoqi Zhang. Mechanical, Thermodynamic
and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals.
Materials 2017, 10（12）, 1419. (SCI)
[26]
Wei Qiqin, Xiao Jing, Chen Shirong, Wang Quan, Sun Peng, Cai Miao, Yang
Daoguo, Design and analysis of a novel phase-shifted Bragg grating for
Bloch surface waves, IEEE Photonics Journal, 10(5), pp 5700706, 2018/09 (SCI收录).
[27] Daoguo Yang, Ning Yang*,
Jiaming Ni, Jing Xiao, Junke Jiang, Qiuhua Liang, Tianlin Re, Xianping
Chen, First-principles approach to design and evaluation of graphene as
methane sensors, Materials & Design; 2017, Vol. 119,
Pages: 397-405. (SCI收录, IF: 4.364，中科院JCR 2区)
[28] Miao Cai,Daoguo Yang*,Jianlin
Huang,Maofen Zhang,Xianping Chen,Caihang Liang, Sau Koh,Guoqi Zhang, Color
Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing,
IEEE Photonics Journal,2017 , 9 (1) :1-14;. (SCI收录, IF: 2.291，中科院JCR 2区)
[29] Miao Cai, Daoguo Yang*,
Yuezhu Mo, et al.,Determining the thermal stress limit of LED lamps using
highly accelerated decay testing, Applied Thermal Engineering. 102(5) (2016),
pp. 1451-1461. (SCI收录, IF: 3.444，中科院JCR 2区，Top期刊)
[30] Miao Cai, Daoguo Yang*, Jianna
Zheng，Yuezhu
Mo，Jianlin
Huang，Jiwen
Xu，Wenbin
Chen，Guoqi
Zhang，Xianping
Chen, Thermal degradation kinetics of LED lamps in step-up-stress and step-down-stress
accelerated degradation testing, Applied Thermal Engineering；2016, 107:
918-926.(SCI收录, IF: 3.444，中科院JCR 2区，Top期刊)
[31] Jing Xiao, Qi-Qin Wei, Dao-Guo
Yang, Ping Zhang ; Ning He ; Guo-Qi Zhang ; Tian-Ling Ren ; Xian-Ping Chen,
A CMOS-Compatible Hybrid Plasmonic Slot Waveguide with Enhanced Field
Confinement, IEEE Electron Device Letters, 2016, 37(4).(SCI收录, IF: 3.048，中科院JCR 2区)
[32] Qiuhua Liang, Junke Jiang, Ruishen
Meng, Huaiyu Ye, Chunjian Tan, Qun Yang, Xiang Sun, Daoguo Yang and
Xianping Chen*，Tuning the electronic properties
and work functions of graphane/fully hydrogenated h-BN heterobilayers via
heteronuclear dihydrogen bonding and electric field control；Physical Chemistry
Chemical Physics；2016, 18（24）： 16386--16395；SCI（2区）
4.123
[33] Miao Cai, Daoguo Yang*,
KunmiaoTian,Wenbin Chen, Xianping Chen, Ping Zhang, Xuejun Fan, Guoqi Zhang, A
Hybrid Prediction Method on Luminous Flux Maintenance of High-Power LED Lamps,
Applied Thermal Engineering, 95 (2016) , pp:482–490. 2016. (SCI收录, IF: 2.739，中科院JCR 2区，Top期刊)
[34] Zhe Li, Daoguo Yang*, Weidong
Hao, Tiecheng Wu, Song Wu, Xiaoping Li, A novel technique for micro-hole
forming on skull with the assistance of ultrasonic vibration, Journal of the
Mechanical Behavior of Biomedical Materials, Volume 57, April 2016, Pages
1-13.(SCI收录, IF: 3.11，中科院JCR 2区)
[35] Miao Cai, Daoguo Yang*,
Xianping Chen, Ping Zhang, et al. Step-stress accelerated testing of high-power
LED lamps based on subsystem isolation method. Microelectronics Reliability, 55
(2015) pp. 1784-1789. (SCI 收录)
[36] Jianlin Huang, Golubovic, D.S.; Sau
Koh; Daoguo Yang, Xiupeng Li, Xuejun Fan, and G. Q. Zhang,
“Rapid degradation of mid-power white-light LEDs in saturated moisture
conditions,” IEEE Transactions on Device and Materials Reliability, Volume: 15,
Issue: 4, 2015, pp: 478 - 485. (SCI收录)
[37] Jianlin Huang, D. S. Golubovic, Sau
Koh, Daoguo Yang, Xiupeng Li, Xuejun Fan, G.Q. Zhang, “Optical
degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests,”
Microelectronics Reliability，55 (2015) , pp: 2654–2662. (SCI收录)
[38] Miao Cai, Daoguo Yang, Xianping
Chen, Ping Zhang, et al. Step-stress accelerated testing of high-power LED
lamps based on subsystem isolation method. Microelectronics Reliability, 55
(2015) pp. 1784-1789. (SCI 收录)
[39] Zaifu Cui, Miao Cai, Xianping Chen, Daoguo
Yang, et al. A numerical procedure for simulating thermal oxidation
diffusion of epoxy molding compounds. Microelectronics Reliability, 55 (2015)
pp. 1877-1881. (SCI收录, SCI收录, IF: 1.433)
[40] J. Huang, D. S. Golubovic, S.
Koh, D. Yang(杨道国), X. Li, X. Fan, and G.
Zhang, “Degradation modeling of mid-power white-light LEDs by using Wiener
process,” Optics express, vol. 23, no. 15, pp. A966-A978, 2015. (SCI收录)
[41] Jianlin Huang, Dusan S. Golubovic, Sau
Koh, Daoguo Yang, Xiupeng Li, Xuejun Fan, and G. Q. Zhang,
“Degradation Mechanisms of Mid-power White-light LEDs under High
Temperature-Humidity Conditions,” IEEE Transactions on Device and Materials
Reliability, Vol. 15, No. 2, 2015, pp. 220-228. (SCI收录, IF: 1.575，3区)
[42] Weijie Liang, Ping Zhang, Xianping
Chen, Miao Cai, Daoguo Yang， Genetic
Algorithm (GA)-Based Inclinometer Layout Optimization, Sensors, 2015, 15(4),
9136-9155 (SCI收录, , IF 2.677，3区)
[43] Ning Yang, Xianping Chen, Tianling Ren,
Ping Zhang, Daoguo Yang*, “Carbon nanotube based biosensors,”
Sensors and Actuators B: Chemical, vol. 207 pp. 690–715, Oct. 2015. (SCI收录, IF:5.401，1区，Top期刊)
[44] X.P. Chen , N. Yang, J.K. Jiang, Q.H.
Liang, D.G. Yang, G.Q. Zhang, and T.L. Ren, “Ab initio study
of temperature, humidity and covalent functionalization induced band gap change
of single-walled carbon nanotubes,” IEEE Electron Device Letters, vol. 36(6),
pp. 606–608, Jun. 2015. (SCI收录, IF: 3.048，2区)
[45] X. P. Chen, J. K. Jiang, Q. H. Liang, N.
Yang, H. Y. Ye, M. Cai, L. Shen, D. G. Yang , T. L. Ren,
“First-principles study of the effect of functional groups on polyaniline
backbone,” Scientific Reports, vol. 5, pp: 1690-7, 2015. (SCI收录, IF: 5.578，2014中科院JCR 2区)
[46] Ping Zhang, Jianhua Zeng, Xianping
Chen, Miao Cai, Jing Xiao, DaoGuo Yang. An Experimental
Investigation of a 100 W High-power LEDs Array Using Vapor Chamber-based Plate,
Advances in Mechanical Engineering, 2015, Vol. 7(11) 1–7. (SCI收录，IF:0.827)
[47] X. P. Li, Q. Xia, D. Qu, T. C. Wu, D.
G. Yang, W. D. Hao, X. Jiang & X. M. Li，The Dynamic Dielectric
at a Brain Functional Site and an EM Wave Approach to Functional Brain Imaging，Scientific Reports,
2014, vol. 4, pp:6893-6893. (SCI 收录, IF: 5.578, 2014中科院JCR 2区)
[48] M. Cai, D. J. Xie, W. B. Chen, B.Y.
Wu, D. G. Yang, G. Q. Zhang. A Novel Soldering Method to
Evaluate PCB Pad Cratering for Pin-Pull Testing, Microelectronics Reliability,
53, pp1568–1574, 2013. (SCI 收录, IF: 1.433)
[49] Yang, D.G., Wan, F.F.,
Shou, Z.Y., van Driel, W.D., Scholten, H., Goumans, L., Faria, R, Effect of high
temperature aging on reliability of automotive electronics，Microelectronics
Reliability，2011,51: 1938-1942。(SCI收录)
[50] Hou, Fengze, Yang, Daoguo, Zhang,
Guoqi，Thermal
analysis of LED lighting system with different fin heat sinks，Journal of Semiconductors,
32(1), 2011(EI)
[51] Yang, D.G., (SCI 收录) K.M.B.
Jansen, L.G. Wang, L.J. Ernst, G.Q. Zhang, H.J.L. Bressers, X.J. Fan,
“Micromechanical modelling of stress evolution induced during cure in a
particle-filled electronic packaging polymer”, IEEE Transactions on Components
and Packaging Technologies, Vol.27, No. 4, pp: 676-683, 2004.
[52] Yang, D. G., (SCI
收录) J.
S. Liang, Q. Y. Li, L. J. Ernst and G. Q. Zhang, “Parametric study on flip chip
package with lead-free solder joints by using the probabilistic designing
approach”, Microelectronics Reliability, Vol. 44, No. 12, 2004, pp: 1947-1955.
[53] Yang, D.G., (SCI 收录) G.Q.
Zhang, L.J. Ernst, C. van't Hof, J.F.J. Caers, H.J.L. Bressers, J. Janssen,
“Investigation on Flip Chip Solder Joint Fatigue with Cure-Dependent Underfill
Properties,” IEEE Transactions on Components and Packaging Technologies,
Vol.26, No. 2, pp: 388-398, 2003.
[54] Yang, Daoguo, Kengen,
Martien, Peels, W. G. M., Heyes, David, van Driel, W. D., Reliability modeling
on a MOSFET power package based on embedded die technology,
Microelectronics Reliability, 50(7), pp 923-927, 2010/7 (SCI收录).
[55] Yang, D.G., (SCI 收录) K.M.B.
Jansen, L.J. Ernst, G.Q. Zhang, H.J.L. Bressers and J.H.J. Janssen, “Effect of
filler concentration of rubbery shear and bulk modulus of moulding compounds,”
Microelectronics Reliability, Vol. 47, Issues 2-3, 2007, pp: 233-239.
[56] Yang, D.G.,
(SCI 收录) K.M.B.
Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers and J.H.J.
Janssen, “Numerical modelling of warpage induced in QFN array moulding
process,” Microelectronics Reliability, Vol. 47, Issues 2-3, 2007, pp: 310-318.
[57] Hochstenbach, P.H., W.D. van
Driel, D.G. Yang, J.J.M. Zaal, E. Bagerman, “Design for
Reliability Using a New Wafer Level Package Structure”, Microelectronics
Reliability, Volume 50, Issue 4 Pages 455-582 (April 2010).
[58] W.D. van Driel, D.G.
Yang, and G.Q. Zhang, “On chip–package stress interaction”,
Microelectronics Reliability, Vol. 48, Issues 8-9 (2008), pp: 1268-1272.
(SCI 收录)
[59] Yang Ping, Li Zhihua, Yang
Daoguo, (SCI 收录) Parametric matching
selection approach for Satellite Gear Mechanism, International Journal of
Product Development 2008 - Vol. 6, No.1 pp. 23 – 35.
[60] W.D. van Driel, D.G. Yang, (SCI
收录) C.
A. Yuan, M. van Kleef, G.Q. Zhang, Mechanical Reliability Challenges for MEMS
Packages: Capping, Microelectronics Reliability, Vol. 47 (2007), pp: 1823-1826.
[61] van’t Hof, C. , K.M.B. Jansen, G.
Wisse, L.J. Ernst, D.G. Yang, (SCI 收录) G.Q.
Zhang and H.J.L. Bressers, “Novel shear tools for viscoelastic characterization
of packaging polymers,” Microelectronics Reliability, Vol. 47, Issues
2-3, 2007, pp: 240-247.
[62] Yang, P., Liao, N.B., and Daoguo
Yang (SCI 收录) , “Property
simulation for nano-scale interfacial friction between two kinds of material in
MEMS based on an atomistic simplified model”, International Journal of Modern
Physics B, Volume 21, Issue 20, pp. 3581-3590 (2007).
[63] Van Driel, W.D., O. van der
Sluis, D.G. Yang, (SCI 收录) R.
Ubachs, C. Zenz, G. Aflenzer, G.Q. Zhang, “Reliability Modelling for Packages
in Flexible End-Products”, Microelectronics Reliability, Vol. 46 (2006), pp.
1880-1885.
[64] Yang Ping, Liao Ning Bo, Yang
Daoguo, (SCI 收录) and L. J. Ernst,
Sliding simulation for adhesion problems in micro gear trains based on an
atomistic simplified model, Microsystem Technologies, Vol. 12, No. 12, 2006.
[65] W. D. van Driel, J. H. J. Janssen, G. Q.
Zhang, D. G. Yang, (SCI 收录) and
L. J. Ernst, “Packaging Induced Die Stresses-Effect of Chip Anisotropy and
Time-Dependent Behaviour of a Moulding Compound,” Journal of Electronic
Packaging, Vol. 125 (4), pp. 465-629, 2003.
[66] Ernst, L.J., C. van ‘t Hof, D.G.
Yang, (SCI 收录) M.S. Kiasat, G.Q.
Zhang, H.J.L. Bressers, J.F.J. Caers, A.W.J. den Boer, J. Janssen “Mechanical
modelling and characterization of the curing process of underfill materials”,
Journal of Electronic Packaging, Vol.124 (2), pp: 97-105, 2002.
[67] Yang, D.G., (SCI 收录) L.J.
Ernst, C. van ‘t Hof, J. Bisschop, J. Janssen, F. Kuper, Z. N. Liang , R.
Schravendeel, G.Q. Zhang, “Vertical die crack stresses of Flip Chip
induced in major package assembly processes,” Microelectronics
Reliability, Vol.40, (2000), pp. 1533-1538.